From quantum to wireless: Enhancing chip-scale communication with terahertz tech
As computing technology advances, we have shifted from using large, single-chip processors to systems made up of smaller, specialized chips called “chiplets.” These chiplets work together to boost processing power and efficiency.
This transition is crucial because we’ve reached the physical limits of how many transistors can fit on a single chip. As transistors shrink, problems such as overheating and power inefficiency become more severe.[1] Using multiple chiplets in one system can increase computing power without facing these physical constraints.
The challenge of communication between chiplets
Traditionally, communication within a chip has been managed by a system called Network-on-Chip (NoC), which acts like a data highway. This method becomes inefficient as systems get more complex, especially with multiple chiplets. Data has to travel farther across more grid points, slowing communication and increasing energy consumption.
When we scale this approach to various chiplets, we create what’s known as Network-in-Package (NiP). However, the same issues—delays, energy inefficiency, and limited scalability—still exist as wired connections dominate data transfer.
To solve these problems, researchers are exploring wireless communication at the chip level. Instead of relying on wires, chiplets could communicate wirelessly using tiny antennas.
Terahertz (THz) frequencies, electromagnetic waves between infrared and microwave, offer high-speed data transfer, making them ideal for this application. However, THz signals are highly noise-sensitive, disrupting communication and making it harder to decode transmitted data.
Floquet engineering: Improving signal detection
Our research addresses this issue with Floquet engineering, a technique from quantum physics that helps control electron behavior in a material when exposed to high-frequency signals.[2,3,4] This technique makes the system more responsive to certain frequencies, improving the detection and decoding of THz wireless signals, even in noisy conditions.
We applied this method to a two-dimensional semiconductor quantum well (2DSQW)—a very thin layer of semiconductor material that restricts electron movement to two dimensions. This setup enhances the system’s ability to detect THz signals, even when noise interference is high. Our research is published in the IEEE Journal on Selected Areas in Communications.
Dual-signaling architecture for more accurate communication
To further improve noise handling, we developed a dual-signaling architecture, where two receivers work together to monitor signals. This setup allows the system to adjust a key parameter, called reference voltage, based on the noise levels detected. This real-time adjustment significantly improves signal decoding accuracy.
Our simulations showed that this dual-signaling system reduces error rates compared to traditional single-receiver systems, ensuring reliable communication in noisy environments—a critical requirement for chip-scale wireless communication.
By overcoming the challenges of noise and signal degradation, our dual-signaling technique marks a key advancement in developing high-speed, noise-resistant wireless communication for chiplets. This innovation brings us closer to creating more efficient, scalable, and adaptable computing systems for the technologies of tomorrow.
This story is part of Science X Dialog, where researchers can report findings from their published research articles. Visit this page for information about Science X Dialog and how to participate.
More information:
Kosala Herath et al, A Dual-Signaling Architecture for Enhancing Noise Resilience in Floquet Engineering-Based Chip-Scale Wireless Communication, IEEE Journal on Selected Areas in Communications (2024). DOI: 10.1109/JSAC.2024.3399206
1 Malin Premaratne and Govind P. Agrawal, Theoretical foundations of nanoscale quantum devices, Cambridge University Press (2021). DOI: 10.1017/9781108634472
2 Kosala Herath et al, Generalized model for the charge transport properties of dressed quantum Hall systems, Physical Review B (2022). DOI: 10.1103/PhysRevB.105.035430
3 Kosala Herath et al, Floquet engineering of dressed surface plasmon polariton modes in plasmonic waveguides, Physical Review B (2022). DOI: 10.1103/PhysRevB.106.235422
4 Kosala Herath et al, A Floquet engineering approach to optimize Schottky junction-based surface plasmonic waveguides, Scientific Reports (2023). DOI: 10.1038/s41598-023-37801-x
Bios:
Kosala Herath received the B.Sc. degree (Hons.) in electronic and telecommunication engineering from the University of Moratuwa, Sri Lanka, in 2018. He is currently pursuing the Ph.D. degree with the Department of Electrical and Computer System Engineering, Monash University, Australia. From 2018 to 2020, he was with WSO2 Inc. His research interests include nanoplasmonics, non-equilibrium many-body quantum systems, chip-scale wireless communication systems, and quantum computing.
Ampalavanapillai Nirmalathas received the Ph.D. degree in electrical and electronic engineering from The University of Melbourne. He is currently the Acting Dean with the Faculty of Engineering and Information Technology, the Lead of the Wireless Innovation Laboratory (WILAB), and a Professor of electrical and electronic engineering with The University of Melbourne. His current research interests include microwave photonics, optical-wireless network integration, broadband networks, photonic reservoir and edge computing, and scalability of telecom and internet services. Since 2021, he has been the Chair of the IEEE Photonics Society’s Future Technologies Task Force. From 2020 to 2021, he was the Co-Chair of the IEEE Future Networks Initiative’s Optics Working Group. He is also the Deputy Co-Chair of the National Committee on Information and Communication Sciences of the Australia Academy of Sciences.
Sarath D. Gunapala received the Ph.D. degree in physics from the University of Pittsburgh, Pittsburgh, PA, USA, in 1986. Since then, he has studied infrared properties of III–V compound semiconductor heterostructures and the development of quantum well infrared photodetectors for infrared imaging at AT&T Bell Laboratories. In 1992, he joined NASA’s Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, USA, where he is currently the Director of the Center for Infrared Photodetectors. He is also a Senior Research Scientist and a Principal Member of the Engineering Staff with the NASA Jet Propulsion Laboratory. He has authored more than 300 publications, including several book chapters on infrared imaging focal plane arrays, and holds 26 patents.
Malin Premaratne earned several degrees from the University of Melbourne, including a B.Sc. in mathematics, a B.E. in electrical and electronics engineering (with first-class honors), and a PhD in 1995, 1995, and 1998, respectively. He has been leading the research program in high-performance computing applications to complex systems simulations at the Advanced Computing and Simulation Laboratory, Monash University, Clayton, since 2004. Currently, he serves as the Vice President of the Academic Board of Monash University and is a Full Professor. In addition to his work at Monash University, Professor Premaratne is also a Visiting Researcher at several prestigious institutions, including the Jet-Propulsion Laboratory at Caltech, the University of Melbourne, the Australian National University, the University of California Los Angeles, the University of Rochester New York, and Oxford University. He has published more than 250 journal papers and two books and has served as an associate editor for several leading academic journals, including IEEE Photonics Technology Letters, IEEE Photonics Journal and Advances in Optics and Photonics. Professor Premaratne’s contributions to the field of optics and photonics have been recognized with numerous fellowships, including the Fellow of the Optical Society of America (FOSA), the Society of Photo-Optical Instrumentation Engineers USA (FSPIE), the Institute of Physics U.K. (FInstP), the Institution of Engineering and Technology U.K. (FIET) and The Institute of Engineers Australia (FIEAust).
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From quantum to wireless: Enhancing chip-scale communication with terahertz tech (2024, September 25)
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