• August 26, 2024

2025 MBE & QIF Summit Call for Presentations Open

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  • August 16, 2024

Biden-Harris Administration Announces Preliminary Terms with Texas Instruments to Expand U.S. Current-Generation and Mature-Node Chip Capacity

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  • August 6, 2024

Spotlight: SURF Student Zainab Altamimi Spends Her Summer Researching the Capsules and Tablets in 3D Drug Printing

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  • August 6, 2024

U.S. Department of Commerce Announces Preliminary Terms with SK hynix to Advance U.S. AI Supply Chain Security

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  • August 1, 2024

NIST Reports that IEEE 802.11 OFDMA Frame Triggering Could Improve Latency for Time-critical Applications Using Wireless

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  • August 1, 2024

NIST Publishes Recommendations to Use Universally Unique Identifiers (UUIDs) in Manufacturing Life Cycle Data

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  • July 26, 2024

Biden-Harris Administration Announces Preliminary Terms with Amkor Technology to Bring Cutting-Edge Advanced Packaging Technology to the U.S. for Leading-Edge Semiconductors

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  • July 24, 2024

Department of Commerce and National Science Foundation partner to advance semiconductor workforce development

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  • July 19, 2024

Dr. Dev Palmer Joins the CHIPS for America Research and Development Office

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  • July 17, 2024

Biden-Harris Administration Announces Preliminary Terms with GlobalWafers to Significantly Increase Production of Silicon Wafers in U.S.

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